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HSDL-3002
IrDA(R) Data Compliant Low Power 115.2 kbit/s with Remote Control Transmission Infrared Transceiver
Data Sheet
Description
The HSDL-3002 is a small form factor single enhanced infrared (IR) transceiver module that provides the combination of (1) interface between logic and IR signals for through-air, serial, half-duplex IR data link, and (2) IR remote control transmission operating at 940 nm for universal remote control applications. For infrared data communication, the HSDL-3002 provides the flexibility of Low Power SIR applications and remote control applications depending on the application circuit designs as outlined in the Application Circuit section. The transceiver is compliant to IrDA Physical Layer Specifications version 1.4 from 9.6 kbit/s to 115.2 kbit/s and it is IEC 825-Class 1 Eye Safe. The HSDL-3002 can be shutdown completely to achieve very low power consumption. In the shutdown mode, the PIN diode will be inactive and thus producing very little photocurrent even under very bright ambient light. Such features are ideal for battery operated handheld products.
Features
* Guaranteed temperature performance, -20 to 70C - Critical parameters are guaranteed over temperature and supply voltage * Low power consumption * Small module size - Height: 2.70 mm - Width: 9.10 mm - Depth: 3.65 mm * Withstands >100 mVp-p power supply ripple typically * VCC supply 2.7 to 5.5 volts * Integrated EMI shield * Designed to accommodate light loss with cosmetic windows * IEC 825-class 1 eye safe
IrDA Data Features
* Fully compliant to IrDA physical layer specifications version 1.4 from 9.6 kbit/s to 115.2 kbit/s - Excellent nose-to-nose operation - Link distance up to 50 cm * Complete shutdown for TXD(IrDA), RXD(IrDA), and PIN diode * Low shutdown current (10 nA typical) * LED stuck-high protection
Remote Control Features
* High radiant intensity * Spectrally suited to remote control receiver * Typical link distance at 6 m
Applications
* Mobile data communication and universal remote control - PDAs - Mobile phone
Application Support Information
The Application Engineering Group is available to assist you with the application designs associated with the HSDL-3002 infrared transceiver module. You can contact them through your local sales representatives for additional details.
Ordering Information
Part Number HSDL-3002-007 Packaging Type Tape and Reel Package Front View Quantity 2500
Marketing Information
The unit is marked with a number "1" and "YWWLL" on the shield for front option. Y = year WW = work week LL = lot information
VCC CX2
CX1 VCC (6) GND (8)
NC (7) RXD (IrDA) (4)
SD (5) V (RC) (2) IrDA TXD TXD (IrDA) (3)
HSDL-3002
SHIELD
TRANSMITTER
REMOTE CONTROL INPUT (RCI)
RECEIVER
REAR VIEW
LEDA (1)
R2
R1
8 7 6 5 4 3 2 1
VCC
Figure 1. Functional block diagram of HSDL-3002.
Figure 2. Rear view diagram with pin-out.
2
I/O Pins Configuration Table
Pin 1 2 3 Symbol LED A V(RC) I/O Description I I IR and Remote Control LED Anode Remote Control LED Cathode IrDA Transmitter Data Input. Active High IrDA Receiver Data Output. Active Low Shutdown. Active High Supply Voltage No internal connection Connect to system ground EMI Shield Connect to system ground Connect to system ground via a low inductance trace. For best performance, do not connect to GND directly at the part. Notes Tied through external resistor, R1, to regulate VCC from 2.7 to 5.5 Volt Connected to an external switching transistor. Do not float the input pin of the swithcing transistor. Logic high turns on the LED. If held high longer than ~50 s, the LED is turned off. TXD (IrDA) must be driven either high or low. DO NOT leave the pin floating. Output is at low pulse response when light pulse is seen. Complete shutdown TXD(IrDA), RXD(IrDA), and PIN diode Regulated, 2.7 to 5.5 Volt
TXD (IrDA) I
4 5 6 7 8 -
RXD (IrDA) O SD VCC NC GND SHIELD I I I -
Recommended Application Circuit Components
Component R1[1] Recommended Value 2.2 5%, 0.25 Watt for 2.7 VCC 3.3 V 2.7 5%, 0.25 Watt for 3.0 VCC 3.6 V 6.8 5%, 0.25 Watt for 4.5 VCC 5.5 V 0 , 0.25 Watt for 4.5 VCC 5.5 V 0.47 F 20%, X7R Ceramic 6.8 F 20%, Tantalum N-Channel Logic Level MOSFET (Philip's BSH103) with less than 1 `ON' resistance
R2 CX1[2] CX2[3] Q1
Notes: 1. R1 is used to optimize the performance of the 870 nm LED, while R2 is the current limiting resistor for the 940 nm RC LED. 2. CX1 must be placed within 0.7 cm of HSDL-3002 to obtain optimum noise immunity. 3. In environment with noisy power supplies, supply rejection can be enhanced by including CX2 as shown in Figure 1.
3
Transceiver I/O Truth Table
Inputs Transceiver Mode Shutdown IrDA (TXD) Remote Control Input Active Active Active Active Active Shutdown
X = Don't Care
Outputs EI High[4] Low X X X Low IR LED Off Off Off On On Not Valid RC LED Off Off On Off On Not Valid RXD Low[5] High Not Valid Not Valid Not Valid Not Valid
0 0 0 0 0 1
0 0 0 1 1 X[6]
0 0 1 0 1 X[6]
EI = In-Band Infrared Intensity at detector
Notes: 4. In-Band EI 115.2 kb/s. 5. Logic Low is a pulsed response. The condition is maintained for duration dependent on the pattern and strength of the incident intensity. 6. To maintain low shutdown current, TXD need to be driven high or low and not left floating. The Remote Control Input should be tied low.
CAUTION: The BiCMOS inherent to this design of this component increases the component's susceptibility to damage from electrostatic discharge (ESD). It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation, which may be induced by ESD.
Absolute Maximum Ratings For implementations where case to ambient thermal resistance is 50C/W.
Parameter Storage Temperature Operating Temperature LED Supply Voltage Supply Voltage Output Voltage: RXD LED Current Pulse Amplitude Symbol TS TA VLED VCC VO ILED Min. -40 -20 0 0 -0.5 Max. 100 70 7 7 7 500 Units C C V V V mA 90 s Pulse Width 20% duty cycle Conditions
Recommended Operating Conditions
Parameter Operating Temperature Supply Voltage Logic Input Voltage for TXD Logic High Logic Low Receiver Input Irradiance TXD Pulse Width (SIR) Receiver Data Rate 4 Logic High Logic Low Symbol TA VCC VIH VIL EIH EIL tTPW (SIR) 1.5 9.6 Min. -20 2.7 2/3 VCC 0 0.0081 Max. 70 5.5 VCC 500 0.3 1.6 115.2 Units C V V mW/cm2 For in-band signals 115.2 kbps[7] mW/cm2 For in-band signals[7] s kbps tPW (TXD) = 1.6 s at 115.2 kbps Conditions
1/3 VCC V
Electrical & Optical Specifications
Specifications (Min. & Max. values) hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions may be anywhere in their operating range. All typical values (Typ.) are at 25C with VCC set to 3.0 V unless otherwise noted. Parameter Receiver Viewing Angle Peak Sensitivity Wavelength RXD Output Voltage Logic High Logic Low RXD Pulse Width (SIR)[8] RXD Rise and Fall Times Receiver Latency Time[9] Receiver Wake Up Time[10] IR Transmitter IR Radiant Intensity IR Viewing Angle IR Peak Wavelength TXD Logic Levels TXD Input Current LED Current Wakeup Time[11] Maximum Optical PW[12] TXD Rise and Fall Time (Optical) LED Anode on State Voltage RC Transmitter Remote Control (RC) Radiant Intensity[13] RC Viewing Angle RC Peak Wavelength Transceiver Input Current Supply Current High Low Shutdown Idle Active IH IL ICC1 ICC2 ICC3 -1 0.01 -0.02 0.01 290 2 1 1 1 450 8 A A A A mA VI VIH 0 VI VIL VSD VCC - 0.5; TA = 25C VI(TXD) VIL, EI = 0 VI(TXD) VIL IEH 21/2 p 5 30 940 20 60 mW/sr ILEDA = 400 mA, 1/2 15, TXD VIL, TA = 25C, V(RCI) VIH nm High Low High Low Shutdown IEH 21/2 p VIH VIL IH IL IVLED tTW tPW(Max) tr, tf VON(LEDA) -1 2/3 VCC 0 0.02 -0.02 20 30 25 10 30 875 VCC 1/3 VCC 1 1 1000 100 50 600 2.2 40 60 mW/sr ILEDA = 350 mA, 1/2 15, TXD VIH. TA = 25C, V(RCI) VIL nm V V A A nA ns s ns V ILEDA = 350 mA, VI(TXD) VIH, V(RCI) VIL VI VIH 0 VI VIL VI(SD) VIH, TA = 25C 21/2 p VOH VOL tRPW (SIR) tr, tf tL tRW VCC -0.2 0 1 25 25 18 30 875 VCC 0.4 7.5 100 50 100 nm V V s ns s s 1/2 15, CL = 9 pF CL = 9 pF EI = 4 W/cm2 EI = 10 mW/cm2 IOH=-200 A, EI 0.3 W/cm2 Symbol Min. Typ. Max. Units Conditions
5
Notes: 7. An in-band optical signal is a pulse/sequence where the peak wavelength, p, is defined as 850 nm p 900 nm, and the pulse characteristics are compliant with the IrDA Serial Infrared Physical Layer Link Specification. 8. For in band signals 2.4 kbps to 115.2 kbps where 3.6 W/cm2 EI 500 mW/cm2. 9. Latency is defined as the time from the last TXD light output pulse until the receiver has recovered full sensitivity. 10. Receiver Wake up time is measured from VCC power on to valid RXD output. 11. Transmitter wake up time is measured from VCC power on to valid light output in response to a TXD pulse. 12. The optical PW is defined as the maximum time which the LED will turn on, this is to prevent the long turn on time for the LED. 13. The VIH and VIL, when used in reference with RCI, depend on the switching transistor used and should obtain from the transistor datasheet.
ILED vs. RADIANT INTENSITY (mW/Sr) FOR THE 870 nm LED TEMPERATURE = 25C
70
RADIANT INTENSITY (mW/sr)
VLEDA vs. ILED FOR 870 nm LED TEMPERATURE = 25C
2.5 2.4
60
VLEDA (VOLTS)
2.3 2.2 2.1 2.0 1.9 1.8 1.7
50 40 30 20 10 0 50 100 150 200 250 300 350 400 450 500 550 ILED (mA)
1.6 1.5 50 100 150 200 250 300 350 400 450 500 550 ILED (mA)
Figure 3. IR LOP vs. ILED.
Figure 4. IR VLED vs. ILED.
ILED vs. RADIANT INTENSITY (mW/Sr) OF THE 940 nm LED TEMPERATURE = 25C
45
RADIANT INTENSITY (mW/sr)
VLEDA vs. ILED FOR THE 940 nm LED TEMPERATURE = 25C
2.5
40
2.0
30 25 20 15 10 5 0 50 150 250 350 450 550 650
VLEDA (VOLTS)
35
1.5
1.0
0.5 0 50
ILED (mA)
150
250
350
450
550
650
ILED (mA)
Figure 5. RC LOP vs. ILED.
Figure 6. RC VLED vs. ILED.
6
tpw VOH 90% 50% 10%
VOL
tf
tr
Figure 7. RXD output waveform.
tpw LED ON 90% 50% 10% LED OFF
tr
tf
Figure 8. LED optical waveform.
TXD
LED
tpw (MAX.)
Figure 9. TXD "Stuck ON" protection.
SD
SD
RX LIGHT
TXD
RXD
TX LIGHT tRW tTW
Figure 10. Receiver wakeup time definition.
Figure 11. Transmitter wakeup time definition.
7
HSDL-3002 Package Outline (with Integrated Shield)
4.55 MOUNTING CENTER 0.885
9.10 0.15
2.70 0.15 1.35
2.65 1.25
2.60 5.80 1.55
COPLANARITY: +0.05 TO -0.15
;;;; ;;; ;; ;;; ;;; ;; ;;;
R 1.50 R 1.10 2.95 1 2 3 4 5 6 7 8 PITCH 1.00 0.65 0.80
3.65
0.50 ALL DIMENSIONS IN MILLIMETERS (mm). DIMENSION TOLERANCE IS 0.2 mm UNLESS OTHERWISE SPECIFIED.
Figure 12. Package outline dimension.
8
HSDL-3002 Tape and Reel Dimensions
4.00 0.10 5.00 (MAX.) POLARITY PIN 8: GND +0.10 3.46 0 9.50 0.10 +0.10 3.30 0 PIN 1: VLED 0.40 0.10 3.00 0.10 8.00 (MAX.) 8.00 0.10 1.55 0.05 1.13 0.10
1.75 0.10
7.50 0.10 16.00 0.30
MATERIAL OF CARRIER TAPE: CONDUCTIVE POLYSTYRENE MATERIAL OF COVER TAPE: PVC METHOD OF COVER: HEAT ACTIVATED ADHESIVE 3.40 0.20 4.20 0.20
PROGRESSIVE DIRECTION
EMPTY (40 mm MIN.)
PARTS MOUNTED
LEADER (400 mm MIN.)
EMPTY (40 mm MIN.)
"B" "C" 330 80 UNIT: mm
QUANTITY 2500
DETAIL A
DIA. 13.00 0.50 R 1.00 2.00 0.50
B
C
LABEL
21.00 0.80
16.40
+ 2.00 0
DETAIL A
2.00 0.50
Figure 13. Tape and reel dimensions.
9
Moisture Proof Packaging
All HSDL-3002 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 4.
Baking Conditions
If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. Package In reels In bulk Temp. 60C 100C 125C 150C Time 48 hours 4 hours 2 hours 1 hour
UNITS IN A SEALED MOISTURE-PROOF PACKAGE
Baking should only be done once.
PACKAGE IS OPENED (UNSEALED)
Recommended Storage Conditions
Storage Temperature Relative Humidity
YES
10C to 30C below 60% RH
ENVIRONMENT LESS THAN 25C, AND LESS THAN 60% RH?
NO
NO BAKING IS NECESSARY
PACKAGE IS OPENED MORE THAN 72 HOURS
NO
Time from Unsealing to Soldering After removal from the bag, the parts should be soldered within three days if stored at the recommended storage conditions.
YES
PERFORM RECOMMENDED BAKING CONDITIONS
Figure 14. Baking conditions chart.
10
Reflow Profile
230
T - TEMPERATURE - (C)
MAX. 245C R3 R4
200 183 170 150 125 100 R1
R2
90 sec. MAX. ABOVE 183C
R5
50 25 0 P1 HEAT UP 50 100 150 200 P3 SOLDER REFLOW 250 P4 COOL DOWN 300
t-TIME (SECONDS) P2 SOLDER PASTE DRY
Figure 15. Reflow graph.
Process Zone Heat Up Solder Paste Dry Solder Reflow
Symbol P1, R1 P2, R2 P3, R3 P3, R4
T 25C to 125C 125C to 170C 170C to 230C (245C at 10 seconds max.) 230C to 170C 170C to 25C
Maximum DT/Dtime 4C/s 0.5C/s 4C/s -4C/s -3C/s
Cool Down
P4, R5
The reflow profile is a straightline representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different T/time temperature change rates. The T/time rates are detailed in the above table. The temperatures are measured at the component to printed circuit board connections. In process zone P1, the PC board and HSDL-3602 castellation I/O pins are heated to a temperature of 125C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 4C per second to allow for even heating of both the PC board and HSDL-3602 castellation I/O pins. 11
Process zone P2 should be of sufficient time duration (>60 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder, usually 170C (338F). Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 230C (446F) for optimum results. The dwell time above the liquidus point of solder should be between 15 and 90 seconds. It usually takes about 15 seconds to assure proper coalescing of the solder balls into liquid solder and the formation of good solder connections. Beyond a dwell time of 90 seconds, the intermetallic growth within the solder
connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 170C (338F), to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25C (77F) should not exceed -3C per second maximum. This limitation is necessary to allow the PC board and HSDL-3602 castellation I/O pins to change dimensions evenly, putting minimal stresses on the HSDL3602 transceiver.
Appendix A : SMT Assembly Application Note
1.0 Solder Pad, Mask and Metal Stencil
METAL STENCIL FOR SOLDER PASTE PRINTING
STENCIL APERTURE
LAND PATTERN
SOLDER MASK PCBA
Figure 16. Stencil and PCBA.
1.1 Recommended Land Pattern
2.65
3.05 MOUNTING CENTER 1.175 1.10
0.715 2.30 1.20 8 7 0.725 6 5 4 1.00 3 2 1 0.65
0.50
Figure 17. Land pattern.
12
1.2 Recommended Metal Solder Stencil Aperture It is recommended that only a 0.152 mm (0.006 inches) or a 0.127 mm (0.005 inches) thick stencil be used for solder paste printing. This is to ensure adequate printed solder paste volume and no shorting. See the table below the drawing for combinations of metal stencil aperture and metal stencil thickness that should be used. Aperture opening for shield pad is 3.05 mm x 1.1 mm as per land pattern.
APERTURES AS PER LAND DIMENSIONS
t
w l
Figure 18. Solder stencil aperture.
Aperture size(mm) Stencil thickness, t (mm) 0.152 mm 0.127 mm length, l 2.60 0.05 3.00 0.05 width, w 0.55 0.05 0.55 0.05
1.3 Adjacent Land Keepout and Solder Mask Areas Adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD components within this area. The minimum solder resist strip width required to avoid solder bridging adjacent pads is 0.2 mm. It is recommended that two fiducial crosses be placed at midlength of the pads for unit alignment. Note: Wet/Liquid PhotoImageable solder resist/mask is recommended.
10.1
0.2 3.85
SOLDER MASK UNITS: mm
3.2
Figure 19. Adjacent land keepout and solder mask areas.
13
Appendix B : PCB Layout Suggestion
The following shows an example of a PCB layout that would result in good electrical and EMI performance. Things to note: 1. The ground plane should be continuous under the part, but should not extend under the shield trace. 2. The shield trace is a wide, low inductance trace back to the system ground. 3. The AGND pin should be connected to the ground plane and not to the shield tab. 4. C1 and C2 are optional supply filter capacitors; they may be left out if a clean power supply is used. 5. VLED can be connected to either unfiltered or unregulated power supply. If VLED and VCC share the same power supply and C1 is used, the connection should be before the current limiting resistor R2. In a noisy environment, supply rejection can be enhanced by including C2 as well. The layout corresponds to the following application circuit diagram.
VCC CX2
Top View
Bottom View
GND CX1
NC RxD
DIP SWITCH
RECEIVER
SD R1 Q1
TRANSMITTER
R2 is the current limiting resistor, while R1 is a weak pull down resistor for the input of the switching transistor. Do not float the input of the switching MOSFET. The DIP switch is used to select between driving the 875 nm or 940 nm LED.
RC
TxD VCC
R2
Figure 20. PCB layout suggestion.
14
Appendix C : General Application Guide for the HSDL-3002 Infrared IrDA(R) Compliant 115.2 Kb/s Transceiver
Description The HSDL-3002, a wide voltage operating range infrared transceiver is a low-cost and small form factor device that is designed to address the mobile
computing market such as PDAs, as well as small embedded mobile products such as digital cameras and cellular phones. It also includes a 940 nm LED to support universal remote control applications. It is fully compliant to IrDA 1.4 low power specification from 9.6 kb/s to 115.2 kb/s, and supports most remote control codes. The design of the HSDL-
3002 also includes the following unique features: * An additional spectrally suited 940 nm LED * Low passive component count. * Shutdown mode for low power consumption requirement.
Recommended R1 2.2
VCC 3.0 V
Intensity 40 mW/sr 20 mW/sr
Minimum Peak Pulse LED Current 350 mA 400 mA
Selection of Resistor R1 Resistor R1 should be selected to provide the appropriate peak pulse LED current over different ranges of VCC as shown in the table below.
Conditions Turn on 870 nm LED only TxD VIH, V(RC) VIL Turn on 940 nm LED only TXD VIL, V(RC) VIH
The resistor value chosen above is for optimal IrDA operation. For optimized remote control performance, it is recommended to turn on both the 870 nm and 940 nm LEDs. Moreover, separate power control feature can be incorporated for remote control operation by implementing device as shown in Figure 3.
Interface to Recommended I/O Chips The HSDL-3002's TXD data input is buffered to allow for CMOS drive levels. No peaking circuit or capacitor is required. Data rate from 9.6 kb/s up to 115.2 kb/s is available at the RXD pin. The V(RC), pin 2, in conjunction with TxD (IrDA), pin 3, can be used to send remote control codes. Pin 2
is driven through a switching FET transistor with a very low onresistance capable of driving 400 mA of current for remote control operation. The block diagram below shows how the IrDA port fits into a mobile phone and PDA platform.
SPEAKER
AUDIO INTERFACE DSP CORE MICROPHONE
ASIC CONTROLLER RF INTERFACE TRANSCEIVER MOD/ DE-MODULATOR MICROCONTROLLER USER INTERFACE IR RC
HSDL-3002 MOBILE PHONE PLATFORM
Figure 21. IR layout in mobile phone platform.
15
LCD PANEL
RAM
RC IR HSDL-3002 CPU FOR EMBEDDED APPLICATION
ROM
PCMCIA CONTROLLER
TOUCH PANEL
RS232C DRIVER
COM PORT
PDA PLATFORM
Figure 22. IR layout in PDA platform.
The link distance testing was done using typical HSDL-3002 units with National Semiconductor's PC87109 3 V Super I/O controller and SMC's FDC37C669 and FDC37N769 Super I/O controllers. An IrDA link distance of up to 100 cm was demonstrated.
Remote Control Operation
HSDL-3002 comes with an additional spectrally suited 940 nm LED for remote control applications. Remote control applications are not governed by any standards, owing to which there are numerous remote control codes in the market. Each of these standards results in receiver modules with different sensitivities, depending on the carrier frequencies and responsivity to the incident light wavelength.
Based on a survey of some commonly used remote control receiver modules, the irradiance is found to be in the range of 0.05~0.07 W/cm2. Based on a typical irradiance of 0.075 W/ cm2 and turning on both 870 nm and 940 nm LEDs, a typical link distance of 6 m is achieved. For a more exhaustive note on implementing remote control using HSDL-3002, please refer to the application note.
16
Appendix D : Window Designs for HSDL-3002
Optical port dimensions for HSDL-3002 To ensure IrDA compliance, some constraints on the height and width of the window exist. The minimum dimensions ensure that the IrDA cone angles are met without vignetting. The maximum dimensions minimize the effects of stray light. The minimum size corresponds to a cone angle of 30 and the maximum size corresponds to a cone angle of 60.
In the figure below, X is the width of the window, Y is the height of the window and Z is the distance from the HSDL-3002 to the back of the window. The distance from the center of the LED lens to the center of the photodiode lens, K, is 5.8 mm. The equations for computing the window dimensions are as follows: X = K + 2*(Z+D)*tanA Y = 2*(Z+D)*tanA The above equations assume that the thickness of the window is negligible compared to the distance of the module from the back of the window (Z). If they
are comparable, Z' replaces Z in the above equation. Z' is defined as Z' = Z+t/n where `t' is the thickness of the window and `n' is the refractive index of the window material. The depth of the LED image inside the HSDL-3002, D, is 8.6 mm. `A' is the required half angle for viewing. For IrDA compliance, the minimum is 15 and the maximum is 30. Assuming the thickness of the window to be negligible, the equations result in the following tables and graphs:
;;;;;;;; ;;;;;; ;;;;;;;;; ;;;;;; ;;;;;;;; ;;; ;;;;; ;;
OPAQUE MATERIAL IR TRANSPARENT WINDOW Y X IR TRANSPARENT WINDOW K Z A D
OPAQUE MATERIAL
Figure 23. Window design diagram.
17
Aperture Width (x, mm) Module Depth (z) mm 0 1 2 3 4 5 6 7 8 9 Max. 15.73 16.89 18.04 19.19 20.35 21.5 22.66 23.81 24.97 26.12 Min. 10.41 10.94 11.48 12.02 12.55 13.09 13.62 14.16 14.7 15.23
Aperture Height (y, mm) Max. 9.93 11.09 12.24 13.39 14.55 15.7 16.86 18.01 19.17 20.32 Min. 4.61 5.14 5.68 6.22 6.75 7.29 7.82 8.36 8.90 9.43
APERTURE WIDTH (X) vs. MODULE DEPTH 30 25 20 15 10 5 0 X MAX. X MIN.
APERTURE HEIGHT (Y) vs. MODULE DEPTH 25
APERTURE HEIGHT (Y) - mm
APERTURE WIDTH (X) - mm
20
15
10
5 0 Y MAX. Y MIN. 0 1 2 3 4 5 6 7 8 9
0
1
2
3
4
5
6
7
8
9
MODULE DEPTH (Z) - mm
MODULE DEPTH (Z) - mm
Figure 24. Aperture width (X) vs. module depth.
Figure 25. Aperture height (Y) vs. module depth.
Window Material
Almost any plastic material will work as a window material. Polycarbonate is recommended. The surface finish of the plastic should be smooth, without any
texture. An IR filter dye may be used in the window to make it look black to the eye, but the total optical loss of the window should be 10% or less for best optical performance. Light loss should be measured at 875 nm.
The recommended plastic materials for use as a cosmetic window are available from General Electric Plastics.
Recommended Plastic Materials
Material # Lexan 141L Lexan 920A Lexan 940A Light Transmission 88% 85% 85% Haze 1% 1% 1% Refractive Index 1.586 1.586 1.586
Note: 920A and 940A are more flame retardant than 141L. Recommended Dye: Violet #21051 (IR transmissant above 625 nm)
Shape of the Window
From an optics standpoint, the window should be flat. This ensures that the window will not alter either the radiation pattern of the LED, or the receive pattern of the photodiode. If the window must be curved for mechanical or industrial design reasons, place the same curve on the back side of the window that has an identical radius as the front side. While this will not completely eliminate the lens effect of the front curved surface, it will significantly reduce the effects. The amount of change in the radiation pattern is dependent upon the material chosen for the window, the radius of the front and back curves, and the distance from the back surface to the transceiver. Once these items are known, a lens design can be made which will eliminate the effect of the front surface curve. The following drawings show the effects of a curved window on the radiation pattern. In all cases, the center thickness of the window is 1.5 mm, the window is made of polycarbonate plastic, and the distance from the transceiver to the back surface of the window is 3 mm.
Flat Window (First choice)
Curved Front and Back (Second choice)
Curved Front, Flat Back (Do not use)
Figure 26. Shape of windows.
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright (c) 2006 Avago Technologies Pte. All rights reserved. Obsoletes 5988-7424EN 5988-4165EN May 27, 2006

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